ENGINEERING
and TECHNOLOGY RESEARCH

• Email [email protected] to purchase full access to this entire journal issue for only $25.00
• 2020 International Conference on Materials, Control, Automation and Electrical Engineering (MCAEE 2020)
• ISBN: 978-1-60595-680-0
• ISSN: 2475-885X

The 2020 International Conference on Materials, Control, Automation and Electrical Engineering (MCAEE 2020), with support and contribution from worldwide scholars and participants, was opened from March 22 to 23 in Shanghai, China. Due to the outbreak of COVID-19, MCAEE 2020 took the form of online meeting and all presentations and speeches were made online.

MCAEE 2020 focused on the latest advance in control engineering and electrical engineering; it gathered first-class scholars and scientists for communication with purpose to make its contribution for the development of science and technology. With the successful opening of the convention, we believe MCAEE 2020 will achieve its goals. It is a great honor to me to attend the convention as invited speaker and be offered the opportunity to share my work with colleagues from around the globe. It is my belief that we have all obtained inspiring advice and suggestion from the presentation and speeches.

As a standard, DEStech will submit the technical science conference proceedings to be indexed in EI (Citation and Compendex). DEStech will submit the technical science conference proceedings to EI, Clarivate Analytics (formerly Thomson Reuters Web of Science) and CNKI Scholar for worldwide online citation within one month after the Proceedings is completed. Please note that DEStech does not submit Proceedings of Social Science to EI since they will not be accepted for EI Compendex. However, DEStech will submit proceedings of Social Science to Thomson Reuters Conference Proceedings Citation Index-Social Science & Humanities (CPCI-SSH). We also caution our editors that Proceedings containing plagiarized material and Proceedings advertised that they will definitely be accepted by EI will be rejected by EI.

2020 International Conference on Materials, Control, Automation and Electrical Engineering

DEStech Publications, Inc. 
439 North Duke Street Lancaster, Pennsylvania 17602 U.S.A.

Copyright © 2020 by DEStech Publications, Inc.

No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of the publisher.

Manufactured in the U.S.A.

Main entry under title: 
2020 International Conference on Materials, Control, Automation and Electrical Engineering (MCAEE 2020)

ISBN: 978-1-60595-680-0

Permission for publication outside of this Conference Proceeding must be given by the Publisher.

• Email [email protected] to purchase full access to this entire journal issue for only $25.00
• 2nd International Conference on Advanced Control, Automation and Artificial Intelligence (ACAAI 2020)
• ISBN: 978-1-60595-673-2
• ISSN: 2475-885X

2020 2nd International Conference on Advanced Control, Automation and Artificial Intelligence (ACAAI 2020) will be held in Wuhan, China during January 12–13, 2020. Sincerely welcome your participation in this academic discussion for presenting your research results, sharing viewpoints and ideas, obtaining updates on latest technologies and expanding professional and social networking. The first ACAAI held in Shenzhen, China from January 21 to 22, 2018 has been successfully published and indexed by CPCI-S!

The main purpose of ACAAI 2020 is to offer an effective platform for experts in these fields including Advanced Control, Automation and Artificial Intelligence rapidly developed in recent years. And this conference will be conducted mainly in the forms of keynote speech, oral presentations and poster presentations for the analysis of academic researches and future development prospects, which will be a beneficial activity for all the participants to gain innovative opinions both on academic ability and personal experience.

As a standard, DEStech will submit the technical science conference proceedings to be indexed in EI (Citation and Compendex). DEStech will submit the technical science conference proceedings to EI, Clarivate Analytics (formerly Thomson Reuters Web of Science) and CNKI Scholar for worldwide online citation within one month after the Proceedings is completed. Please note that DEStech does not submit Proceedings of Social Science to EI since they will not be accepted for EI Compendex. However, DEStech will submit proceedings of Social Science to Thomson Reuters Conference Proceedings Citation Index-Social Science & Humanities (CPCI-SSH). We also caution our editors that Proceedings containing plagiarized material and Proceedings advertised that they will definitely be accepted by EI will be rejected by EI.

2020 2nd International Conference on Advanced Control, Automation and Artificial Intelligence

DEStech Publications, Inc. 
439 North Duke Street Lancaster, Pennsylvania 17602 U.S.A.

Copyright © 2020 by DEStech Publications, Inc.

No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of the publisher.

Manufactured in the U.S.A.

Main entry under title: 
2020 2nd International Conference on Advanced Control, Automation and Artificial Intelligence (ACAAI 2020)

ISBN: 978-1-60595-673-2

Permission for publication outside of this Conference Proceeding must be given by the Publisher.

• Email [email protected] to purchase full access to this entire journal issue for only $25.00
• 4th International Conference on Automation, Mechanical and Electrical Engineering (AMEE 2019)
• ISBN: 978-1-60595-655-8
• ISSN: 2475-885X

2019 4th International Conference on Electrical Engineering, Mechanical Engineering and Automation (ICEEMEA2019) is an optimal platform for academic communications, exchange of ideas and inspirations between specialists and scholars in the fields of electrical engineering, mechanical engineering and automation, including hot issues such as signal processing, mechanics and robotics.

As a standard, DEStech will submit the technical science conference proceedings to be indexed in EI (Citation and Compendex). DEStech will submit the technical science conference proceedings to EI, Clarivate Analytics (formerly Thomson Reuters Web of Science) and CNKI Scholar for worldwide online citation within one month after the Proceedings is completed. Please note that DEStech does not submit Proceedings of Social Science to EI since they will not be accepted for EI Compendex. However, DEStech will submit proceedings of Social Science to Thomson Reuters Conference Proceedings Citation Index-Social Science & Humanities (CPCI-SSH). We also caution our editors that Proceedings containing plagiarized material and Proceedings advertised that they will definitely be accepted by EI will be rejected by EI.

2019 4th International Conference on Automation, Mechanical and Electrical Engineering

DEStech Publications, Inc.
439 North Duke Street Lancaster, Pennsylvania 17602 U.S.A.

Copyright © 2019 by DEStech Publications, Inc.

No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of the publisher.

Manufactured in the U.S.A.

Main entry under title:
2019 4th International Conference on Automation, Mechanical and Electrical Engineering (AMEE 2019)

ISBN: 978-1-60595-655-8

Permission for publication outside of this Conference Proceeding must be given by the Publisher.

• Email [email protected] to purchase full access to this entire journal issue for only $25.00
• 2019 International Conference on Civil Engineering, Mechanics and Materials Science (CEMMS 2019)
• ISBN: 978-1-60595-649-7
• ISSN: 2475-885X

2019 International Conference on Civil Engineering, Mechanics and Materials Science (CEMMS 2019) will be held in Changsha, China during August 30–31, 2019, co-sponsored by Science and Engineering Research Center, Hong Kong. CEMMS 2019 aims to create an
international academic exchange platform for experts and scholars in the fields of Civil Engineering, Mechanics, Materials Science and other related topics to present their respective research achievements, we sincerely welcome all the experts and scholars to join the academic
conference to present novel and fundamental advances. With the rapid development of Civil Engineering, Mechanics and Materials Science and more disciplines, these fields are widely used in human beings, which shows that the functions of technology and innovation are more reflected in Civil Engineering, Mechanics and Materials Science. In addition, we deeply believed that CEMMS 2019 will be beneficial and exciting by gathering researchers and practitioners from academia and industry together to focus on advancements and new collaborations in the fields of Civil Engineering, Mechanics and Materials Science.

As a standard, DEStech will submit the technical science conference proceedings to be indexed in EI (Citation and Compendex). DEStech will submit the technical science conference proceedings to EI, Clarivate Analytics (formerly Thomson Reuters Web of Science) and CNKI Scholar for worldwide online citation within one month after the Proceedings is completed. Please note that DEStech does not submit Proceedings of Social Science to EI since they will not be accepted for EI Compendex. However, DEStech will submit proceedings of Social Science to Thomson Reuters Conference Proceedings Citation Index-Social Science & Humanities (CPCI-SSH). We also caution our editors that Proceedings containing plagiarized material and Proceedings advertised that they will definitely be accepted by EI will be rejected by EI.

2019 International Conference on Civil Engineering, Mechanics and Materials Science

DEStech Publications, Inc. 
439 North Duke Street Lancaster, Pennsylvania 17602 U.S.A.

Copyright © 2019 by DEStech Publications, Inc.

No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of the publisher.

Manufactured in the U.S.A.

Main entry under title: 
2019 International Conference on Civil Engineering, Mechanics and Materials Science (CEMMS 2019)

ISBN: 978-1-60595-649-7

Permission for publication outside of this Conference Proceeding must be given by the Publisher.

• Email [email protected] to purchase full access to this entire journal issue for only $25.00
• 2019 International Conference on Applied Mathematics, Statistics, Modeling, Simulation (AMSMS 2019)
• ISBN: 978-1-60595-648-0
• ISSN: 2475-885X

As a member of the many scientific communities, I have always believed that we all have benefited from the development of science and society, and in return we should all make our contribution to accelerate the advance of it. It is my great pleasure to witness the successful opening of the famous AMSMS 2019 International Conference on Applied Mathematics, Statistics, Modeling and Simulation in Phuket of Thailand from September 22 to 23. I am thrilled to have met scholars with inspiring speeches and researches for discussion and communication from various countries and regions,
and I am positive that all participants must have acquired knowledge for use in the future work. AMSMS 2019, aiming to be one of the most professional and inspiring forums in mathematics, statistics, modelling and their application, has invited speakers and participants from around the world for presence.
As preparation, it also invited scientists to submit their related researches for reviewing and discussing during the convention. All articles accepted after reviewing are presented at the meeting and included in this

As a standard, DEStech will submit the technical science conference proceedings to be indexed in EI (Citation and Compendex). DEStech will submit the technical science conference proceedings to EI, Clarivate Analytics (formerly Thomson Reuters Web of Science) and CNKI Scholar for worldwide online citation within one month after the Proceedings is completed. Please note that DEStech does not submit Proceedings of Social Science to EI since they will not be accepted for EI Compendex. However, DEStech will submit proceedings of Social Science to Thomson Reuters Conference Proceedings Citation Index-Social Science & Humanities (CPCI-SSH). We also caution our editors that Proceedings containing plagiarized material and Proceedings advertised that they will definitely be accepted by EI will be rejected by EI.

2019 International Conference on Applied Mathematics, Statistics, Modeling, Simulation 
439 North Duke Street 
Lancaster, Pennsylvania 17602 U.S.A. 
Copyright © 2019 by DEStech Publications, Inc. 
No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of the publisher. 
Manufactured in the U.S.A. 
Main entry under title: 
2019 International Conference on Applied Mathematics, Statistics, Modeling, Simulation (AMSMS 2019)
ISBN: 978-1-60595-648-0
Permission for publication outside of this Conference Proceeding must be given by the Publisher.

• Email [email protected] to purchase full access to this entire journal issue for only $25.00
• International Conference on Informatics, Control and Robotics (ICICR 2019)
• ISBN: 978-1-60595-633-6
• ISSN: 2475-885X

Welcome to the 2019 International Conference on Informatics, Control and Robotics (ICICR2019), which will be held on June 16-17, 2019 in Shanghai, China. ICICR2019 will serve people as one of the most important international activities in Informatics, Control and Robotics fields. It will provide a high qualified forum for its participants to access the most knowledge in related world-famous scientists and scholars, and it will make a perfect opportunity for ICICR2019 has received support from world-famous scientists and scholars.

As a standard, DEStech will submit the technical science conference proceedings to be indexed in EI (Citation and Compendex). DEStech will submit the technical science conference proceedings to EI, Clarivate Analytics (formerly Thomson Reuters Web of Science) and CNKI Scholar for worldwide online citation within one month after the Proceedings is completed. Please note that DEStech does not submit Proceedings of Social Science to EI since they will not be accepted for EI Compendex. However, DEStech will submit proceedings of Social Science to Thomson Reuters Conference Proceedings Citation Index-Social Science & Humanities (CPCI-SSH). We also caution our editors that Proceedings containing plagiarized material and Proceedings advertised that they will definitely be accepted by EI will be rejected by EI.

2018 International Conference on Informatics, Control and Robotics

DEStech Publications, Inc.
439 North Duke Street Lancaster, Pennsylvania 17602 U.S.A.

Copyright © 2018 by DEStech Publications, Inc.

No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of the publisher.

Manufactured in the U.S.A.

Main entry under title:
2018 International Conference on Informatics, Control and Robotics (ICICR 2019)

ISBN: 978-1-60595-633-6

Permission for publication outside of this Conference Proceeding must be given by the Publisher.

• Email [email protected] to purchase full access to this entire journal issue for only $25.00
• 2019 International Conference on Advanced Electrical, Mechatronics and Computer Engineering (AEMCE 2019)
• ISBN: 978-1-60595-618-3
• ISSN: 2475-885X

During February 27–28, 2019, there will be a conference to be hosted in Shenzhen, China which is called 2019 International Conference on Advanced Electrical, Mechatronics and Computer Engineering (AEMCE 2019). It will provide a highly competitive forum reporting the latest developments in the research and application of Advanced Electrical, Mechatronics and Computer Engineering. You are also cordially invited to join us with your excellent papers. And it is a high-level international forum that AEMCE 2019 is always willing to provide for
scholars and scientists to participate and present themselves. AEMCE 2019 aims to gather together the qualified and experienced lecturers, experts and researchers, as well as the prospective authors to communicate and increase knowledge that will provide added value in their research field. In addition, the conference enables them to solve the related problems and scientific discoveries, and gives them the precious inspiration in their fields.

As a standard, DEStech will submit the technical science conference proceedings to be indexed in EI (Citation and Compendex). DEStech will submit the technical science conference proceedings to EI, Clarivate Analytics (formerly Thomson Reuters Web of Science) and CNKI Scholar for worldwide online citation within one month after the Proceedings is completed. Please note that DEStech does not submit Proceedings of Social Science to EI since they will not be accepted for EI Compendex. However, DEStech will submit proceedings of Social Science to Thomson Reuters Conference Proceedings Citation Index-Social Science & Humanities (CPCI-SSH). We also caution our editors that Proceedings containing plagiarized material and Proceedings advertised that they will definitely be accepted by EI will be rejected by EI.

2019 International Conference on Advanced Electrical, Mechatronics and Computer Engineering 
439 North Duke Street 
Lancaster, Pennsylvania 17602 U.S.A. 
Copyright © 2019 by DEStech Publications, Inc. 
No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of the publisher. 
Manufactured in the U.S.A. 
Main entry under title: 
2019 International Conference on Advanced Electrical, Mechatronics and Computer Engineering (AEMCE 2019)
ISBN: 978-1-60595-618-3
Permission for publication outside of this Conference Proceeding must be given by the Publisher.

• Email [email protected] to purchase full access to this entire journal issue for only $25.00
• 3rd International Conference on Architectural Engineering and New Materials (ICAENM 2018)
• ISBN: 978-1-60595-609-1
• ISSN: 2475-885X

The 3rd International Conference on Architectural Engineering and New Materials (ICAENM 2018) creates an academic platform for international experts and researchers in relative fields to share and exchange the latest research results and problem solving solutions. ICAENM 2018 has collected advanced results and trends in the field of Civil Engineering, Architectural Engineering, Rock Engineering and New Materials, Building Materials.
This book is a collection of selected academic papers. All the accepted are reviewed and edited by 2–3 expert referees from our academic committee board .This book aims to collect the advanced and practical results of researches and studies on Civil Engineering, Architectural Engineering, Rock Engineering and New Materials, Building Materials etc.
The Scientific Committee of the Conference has made sure that this book will provide the readers with the latest advanced know ledge in these fields as well as a valuable summary and reference.

As a standard, DEStech will submit the technical science conference proceedings to be indexed in EI (Citation and Compendex). DEStech will submit the technical science conference proceedings to EI, Clarivate Analytics (formerly Thomson Reuters Web of Science) and CNKI Scholar for worldwide online citation within one month after the Proceedings is completed. Please note that DEStech does not submit Proceedings of Social Science to EI since they will not be accepted for EI Compendex. However, DEStech will submit proceedings of Social Science to Thomson Reuters Conference Proceedings Citation Index-Social Science & Humanities (CPCI-SSH). We also caution our editors that Proceedings containing plagiarized material and Proceedings advertised that they will definitely be accepted by EI will be rejected by EI.

3rd International Conference on Architectural Engineering and New Materials

DEStech Publications, Inc. 
439 North Duke Street Lancaster, Pennsylvania 17602 U.S.A.

Copyright © 2019 by DEStech Publications, Inc.

No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of the publisher.

Manufactured in the U.S.A.

Main entry under title: 
3rd International Conference on Architectural Engineering and New Materials (ICAENM 2018)

ISBN: 978-1-60595-609-1

Permission for publication outside of this Conference Proceeding must be given by the Publisher.

• Email [email protected] to purchase full access to this entire journal issue for only $25.00
• 3rd International Conference on Electrical, Control and Automation Engineering (ECAE 2018)
• ISBN: 978-1-60595-080-8
• ISSN: 2475-885X

ECAE2018 is dedicated to bring together researchers and practitioners from academia and industry to focus on advancements and establishing new collaborations in the fields of Electrical, Control and Automation Engineering and other related fields. It will not only present top quality papers, but also serve as a forum for discussion of open problems and future research directions.

As a standard, DEStech will submit the technical science conference proceedings to be indexed in EI (Citation and Compendex). DEStech will submit the technical science conference proceedings to EI, Clarivate Analytics (formerly Thomson Reuters Web of Science) and CNKI Scholar for worldwide online citation within one month after the Proceedings is completed. Please note that DEStech does not submit Proceedings of Social Science to EI since they will not be accepted for EI Compendex. However, DEStech will submit proceedings of Social Science to Thomson Reuters Conference Proceedings Citation Index-Social Science & Humanities (CPCI-SSH). We also caution our editors that Proceedings containing plagiarized material and Proceedings advertised that they will definitely be accepted by EI will be rejected by EI.

2018 3rd International Conference on Electrical, Control and Automation Engineering

DEStech Publications, Inc.
439 North Duke Street Lancaster, Pennsylvania 17602 U.S.A.

Copyright © 2018 by DEStech Publications, Inc.

No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of the publisher.

Manufactured in the U.S.A.

Main entry under title:
2018 3rd International Conference on Electrical, Control and Automation Engineering (ECAE 2018)

ISBN: 978-1-60595-080-8

Permission for publication outside of this Conference Proceeding must be given by the Publisher.

• Email [email protected] to purchase full access to this entire journal issue for only $25.00
• 2018 3rd Asia-Pacific Electronics and Electrical Engineering Conference (EEEC 2018)
• ISBN: 978-1-60595-586-5
• ISSN: 2475-885X

The 3rd Asia-Pacific Electronics and Electrical Engineering Conference (EEEC 2018) is scheduled to hold in Shanghai from November 17 to 18, 2018, experts and scholars, a group of the authors and other related people will attend the conference with apparent interest.
When we were collecting the papers for the Electronics and Electrical
Engineering, the interesting things were that a number of authors were quite keen to look for the same chance to make public the experimental and theoretical works of intellectual creativity or formal results of scientific research or practice, written by those who are their former class mates, campus fellows, friends, relatives, colleagues and cooperators. The conference had gathered young researchers, experienced researchers working in Electronics, Engineering and research in area of electronics and technologies in order to share interests and results for a better collaboration and activity visibility.

As a standard, DEStech will submit the technical science conference proceedings to be indexed in EI (Citation and Compendex). DEStech will submit the technical science conference proceedings to EI, Clarivate Analytics (formerly Thomson Reuters Web of Science) and CNKI Scholar for worldwide online citation within one month after the Proceedings is completed. Please note that DEStech does not submit Proceedings of Social Science to EI since they will not be accepted for EI Compendex. However, DEStech will submit proceedings of Social Science to Thomson Reuters Conference Proceedings Citation Index-Social Science & Humanities (CPCI-SSH). We also caution our editors that Proceedings containing plagiarized material and Proceedings advertised that they will definitely be accepted by EI will be rejected by EI.

2018 3rd Asia-Pacific Electronics and Electrical Engineering Conference 
439 North Duke Street 
Lancaster, Pennsylvania 17602 U.S.A. 
Copyright © 2018 by DEStech Publications, Inc. 
No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of the publisher. 
Manufactured in the U.S.A. 
Main entry under title: 
2018 3rd Asia-Pacific Electronics and Electrical Engineering Conference (EEEC 2018)
ISBN: 978-1-60595-586-5
Permission for publication outside of this Conference Proceeding must be given by the Publisher.

• Email [email protected] to purchase full access to this entire journal issue for only $25.00
• 2018 International Conference on Electrical, Control, Automation and Robotics (ECAR 2018)
• ISBN: 978-1-60595-579-7
• ISSN: 2475-885X

It is exciting news for worldwide scholars, and for me, that the 2018 International Conference on Electrical, Control, Automation and Robotics (ECAR 2018) is coming soon on September 16 and 17 in the beautiful Chinese city Xiamen for participation. Supported by first-class researchers and with passionate participants, ECAR 2018 is surely going to be successful and fruitful in achievements and in contribution for subject development. With invited speaker, participants and contributors from around the world, ECAR will focus on recent advance in automation/control engineering and other related topics such as mechanics and advanced design. We will work on research difficulties together and hopefully to solution or direction for these obstacles.
In preparing for ECAR 2018, we have received original researches contributed by scholars from various countries and regions. Submissions of innovation and inspiration had won approval from the reviewers; the contributors were invited to speak on the work during the conference for discussion and we believe they will have great value in helping the research of other participants. Researches with importance in other aspects were also accepted and will be included for the reference of other researchers.

As a standard, DEStech will submit the technical science conference proceedings to be indexed in EI (Citation and Compendex). DEStech will submit the technical science conference proceedings to EI, Clarivate Analytics (formerly Thomson Reuters Web of Science) and CNKI Scholar for worldwide online citation within one month after the Proceedings is completed. Please note that DEStech does not submit Proceedings of Social Science to EI since they will not be accepted for EI Compendex. However, DEStech will submit proceedings of Social Science to Thomson Reuters Conference Proceedings Citation Index-Social Science & Humanities (CPCI-SSH). We also caution our editors that Proceedings containing plagiarized material and Proceedings advertised that they will definitely be accepted by EI will be rejected by EI.

2018 International Conference on Electrical, Control, Automation and Robotics
439 North Duke Street 
Lancaster, Pennsylvania 17602 U.S.A. 
Copyright © 2018 by DEStech Publications, Inc. 
No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of the publisher. 
Manufactured in the U.S.A. 
Main entry under title: 
2018 International Conference on Electrical, Control, Automation and Robotics (ECAR 2018)
ISBN: 978-1-60595-579-7
Permission for publication outside of this Conference Proceeding must be given by the Publisher.

• Email [email protected] to purchase full access to this entire journal issue for only $25.00
• 2018 International Conference on Advance Chemical Engineering and Environmental Sustainability
• ISBN: 978-1-60595-571-1
• ISSN: 2475-885X

The 2018 International Conference on Advanced Chemical Engineering and Environmental Sustainability (ICACEES 2018) creates an academic platform for international experts and researchers in relative fields to share and exchange the latest research results and problem solving solutions. ICACEES 2018 has collected advanced results and trends in the field of Chemical Engineering and Environmental Engineering, etc.
This book is a collection of selected academic papers. All the accepted are reviewed and edited by 2–3 expert referees from our academic committee board .This book aims to collect the advanced and practical results of researches and studies on Chemical Engineering and Environmental Engineering, etc. The Scientific Committee of the Conference has made sure that this book will provide the readers with the latest advanced know ledge in these fields as well as a valuable summary and reference. We express our sincere appreciations to the authors for their contribution to this book. We would also like to express our sincere gratitude to all experts and referees for their valuable comments and the editing of the papers.

As a standard, DEStech will submit the technical science conference proceedings to be indexed in EI (Citation and Compendex). DEStech will submit the technical science conference proceedings to EI, Clarivate Analytics (formerly Thomson Reuters Web of Science) and CNKI Scholar for worldwide online citation within one month after the Proceedings is completed. Please note that DEStech does not submit Proceedings of Social Science to EI since they will not be accepted for EI Compendex. However, DEStech will submit proceedings of Social Science to Thomson Reuters Conference Proceedings Citation Index-Social Science & Humanities (CPCI-SSH). We also caution our editors that Proceedings containing plagiarized material and Proceedings advertised that they will definitely be accepted by EI will be rejected by EI.

2018 International Conference on Advanced Chemical Engineering and Environmental Sustainability 
439 North Duke Street 
Lancaster, Pennsylvania 17602 U.S.A. 
Copyright © 2018 by DEStech Publications, Inc. 
No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of the publisher. 
Manufactured in the U.S.A. 
Main entry under title: 
2018  International Conference on Advanced Chemical Engineering and Environmental Sustainability (ICACEES 2018)
ISBN: 978-1-60595-571-1
Permission for publication outside of this Conference Proceeding must be given by the Publisher.

• Email [email protected] to purchase full access to this entire journal issue for only $25.00
• 2018 3rd International Conference on Automation, Mechanical and Electrical Engineering
• ISBN: 978-1-60595-570-4
• ISSN: 2475-885X

Special thanks to the supports of all parties from academic and industrial circles, the Third International Conference on Automation, Mechanical and Electrical Engineering (AMEE 2018) will be held on July 22–23, 2018 in Shanghai and follows the two previous editions in Phuket, Thailand from July 26–27, 2015 and in Shenzhen, China from September 17–18, 2017. All the previous proceedings have been indexed in CPCI-S successfully. These previous and successful events, both from the viewpoint of their scientific and technical quality, and for the important number of attending delegates, have motivated us in organizing AMEE2018.
   AMEE 2018’s main goal is to continue the precedent efforts in showing the automation, mechanical and electrical engineering research and development of new applications. The conference is open for good quality submissions from any country in the world. It is cosponsored by: Advanced Science and Industry Research Center, Hong Kong and will feature a set of special sessions in distinct fields related with the conference topics.

As a standard, DEStech will submit the technical science conference proceedings to be indexed in EI (Citation and Compendex). DEStech will submit the technical science conference proceedings to EI, Clarivate Analytics (formerly Thomson Reuters Web of Science) and CNKI Scholar for worldwide online citation within one month after the Proceedings is completed. Please note that DEStech does not submit Proceedings of Social Science to EI since they will not be accepted for EI Compendex. However, DEStech will submit proceedings of Social Science to Thomson Reuters Conference Proceedings Citation Index-Social Science & Humanities (CPCI-SSH). We also caution our editors that Proceedings containing plagiarized material and Proceedings advertised that they will definitely be accepted by EI will be rejected by EI.

2018 3rd International Conference on Automation, Mechanical and Electrical Engineering 
439 North Duke Street 
Lancaster, Pennsylvania 17602 U.S.A. 
Copyright © 2018 by DEStech Publications, Inc. 
No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of the publisher. 
Manufactured in the U.S.A. 
Main entry under title: 
2018 3rd International Conference on Automation, Mechanical and Electrical Engineering (AMEE 2018)
ISBN: 978-1-60595-570-4
Permission for publication outside of this Conference Proceeding must be given by the Publisher.

• Email [email protected] to purchase full access to this entire journal issue for only $25.00
• International Conference on Physics, Mathematics, Statistics Modelling and Simulation PMSMS 2018
• ISBN: 978-1-60595-558-2
• ISSN: 2475-885X

As an international scientific forum, PMSMS2018 has attracted worldwide scholars and scientists with interests in related topics and it will be attended on June 29-30, 2018 by invited famous speakers as well as invited authors and contributors in Wuzhen (China), the permanent host place of the World Internet Conference since 2014. The main purpose of PMSMS2018 is to, by fostering communication and cooperation among scientists (for worldwide scholars in general and for its participants in specific), provide impetus to the development of technology.

As a standard, DEStech will submit the technical science conference proceedings to be indexed in EI (Citation and Compendex). DEStech will submit the technical science conference proceedings to EI, Clarivate Analytics (formerly Thomson Reuters Web of Science) and CNKI Scholar for worldwide online citation within one month after the Proceedings is completed. Please note that DEStech does not submit Proceedings of Social Science to EI since they will not be accepted for EI Compendex. However, DEStech will submit proceedings of Social Science to Thomson Reuters Conference Proceedings Citation Index-Social Science & Humanities (CPCI-SSH). We also caution our editors that Proceedings containing plagiarized material and Proceedings advertised that they will definitely be accepted by EI will be rejected by EI.

2018 International Conference on Physics, Mathematics, Statistics Modelling and Simulation

DEStech Publications, Inc.
439 North Duke Street Lancaster, Pennsylvania 17602 U.S.A.

Copyright © 2018 by DEStech Publications, Inc.

No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of the publisher.

Manufactured in the U.S.A.

Main entry under title:
2018 International Conference on Physics, Mathematics, Statistics Modelling and Simulation PMSMS 2018

ISBN: 978-1-60595-558-2

Permission for publication outside of this Conference Proceeding must be given by the Publisher.

• Email [email protected] to purchase full access to this entire journal issue for only $25.00
• International Conference on Mechanical, Electronic and Information Technology (ICMEIT 2018)
• ISBN: 978-1-60595-548-3
• ISSN: 2475-885X

Open and attended by participants on April 15 and 16 in Shanghai (China), the 2018 International Conference on Mechanical, Electronic and Information Technology (ICMEIT) has ended with successful and fruitful results.
In ICMEIT 2018, we not only had speeches delivered by famous speakers and authors, but also enjoyed the opportunity to communicate and discuss each other’s work and find/offer help for future advance.
Research presented in Shanghai and included in this book are all contributed by passionate scholars and researchers before the conference. With support from experienced reviewers and editors, we are able to have them edited and presented in their best forms. The on-line open access to these papers, we believe, is significantly helpful and useful to the progress of research of other scientists who may not have the chance to present the meeting.
During the conference, people have exchanged thoughts on topics including advanced design and control, automation as support to each other. It is exciting to see people working together with passion and enthusiasm for mutual interests.

As a standard, DEStech will submit the technical science conference proceedings to be indexed in EI (Citation and Compendex). DEStech will submit the technical science conference proceedings to EI, Clarivate Analytics (formerly Thomson Reuters Web of Science) and CNKI Scholar for worldwide online citation within one month after the Proceedings is completed. Please note that DEStech does not submit Proceedings of Social Science to EI since they will not be accepted for EI Compendex. However, DEStech will submit proceedings of Social Science to Thomson Reuters Conference Proceedings Citation Index-Social Science & Humanities (CPCI-SSH). We also caution our editors that Proceedings containing plagiarized material and Proceedings advertised that they will definitely be accepted by EI will be rejected by EI.

2018 International Conference on Mechanical, Electronic and Information Technology
439 North Duke Street 
Lancaster, Pennsylvania 17602 U.S.A. 
Copyright © 2018 by DEStech Publications, Inc. 
No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of the publisher. 
Manufactured in the U.S.A. 
Main entry under title: 
2018 International Conference on Mechanical, Electronic and Information Technology (ICMEIT 2018)
ISBN: 978-1-60595-548-3
Permission for publication outside of this Conference Proceeding must be given by the Publisher.

• Email [email protected] to purchase full access to this entire journal issue for only $25.00
• 2nd International Conference on Applied Mechanics, Electronics and Mechatronics Engineering (AMEME 2017)
• ISBN: 978-1-60595-497-4
• ISSN: 2475-885X

2017 2nd International Conference on Applied Mechanics, Electronics and Mechatronics Engineering (AMEME 2017) is going to take place in Beijing, China during October 22–23, 2017. The First AMEME was held in Beijing, China on May 28-29, 2016, the proceedings has been successfully published and indexed. To keep the good tradition of the First AMEME and make more significant contributions in applied mechanics, electronics and mechatronics engineering fields, the organizing committee of AMEME 2017 has gone to great pains to bring together an array of outstanding researchers, and has made meticulous arrangements for the conference.

As a standard, DEStech will submit the technical science conference proceedings to be indexed in EI (Citation and Compendex). DEStech will submit the technical science conference proceedings to EI, Clarivate Analytics (formerly Thomson Reuters Web of Science) and CNKI Scholar for worldwide online citation within one month after the Proceedings is completed. Please note that DEStech does not submit Proceedings of Social Science to EI since they will not be accepted for EI Compendex. However, DEStech will submit proceedings of Social Science to Thomson Reuters Conference Proceedings Citation Index-Social Science & Humanities (CPCI-SSH). We also caution our editors that Proceedings containing plagiarized material and Proceedings advertised that they will definitely be accepted by EI will be rejected by EI.

2017 2nd International Conference on Applied Mechanics, Electronics and Mechatronics Engineering
439 North Duke Street 
Lancaster, Pennsylvania 17602 U.S.A. 
Copyright © 2017 by DEStech Publications, Inc. 
No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of the publisher. 
Manufactured in the U.S.A. 
Main entry under title: 
2017 2nd International Conference on Applied Mechanics, Electronics and Mechatronics Engineering (AMEME 2017)
ISBN: 978-1-60595-497-4
Permission for publication outside of this Conference Proceeding must be given by the Publisher.

• Email [email protected] to purchase full access to this entire journal issue for only $25.00
• 3rd International Conference on Applied Mechanics and Mechanical Automation (3rd AMMA 2017)
• ISBN: 978-1-60595-479-0
• ISSN: 2475-885X

To represent the conference committees, we are excited to announced that 2017 3rd International Conference on Applied Mechanics and Mechanical Automation (AMMA 2017) will be held in Phuket, Thailand from August 6–7, 2017. This is a great opportunity to meet other like-minded scientists in the interdisciplinary fields. As a matter of fact, in 2014, the first AMMA has been held in Macao from May 20–21; in 2015, the second AMMA has been held in Hong Kong from April 19–20. This year, with your valuable contributions we will present the world’s premier conference for the third time.

As a standard, DEStech will submit the technical science conference proceedings to be indexed in EI (Citation and Compendex). DEStech will submit the technical science conference proceedings to EI, Clarivate Analytics (formerly Thomson Reuters Web of Science) and CNKI Scholar for worldwide online citation within one month after the Proceedings is completed. Please note that DEStech does not submit Proceedings of Social Science to EI since they will not be accepted for EI Compendex. However, DEStech will submit proceedings of Social Science to Thomson Reuters Conference Proceedings Citation Index-Social Science & Humanities (CPCI-SSH). We also caution our editors that Proceedings containing plagiarized material and Proceedings advertised that they will definitely be accepted by EI will be rejected by EI.

2017 3rd International Conference on Applied Mechanics and Mechanical Automation
439 North Duke Street 
Lancaster, Pennsylvania 17602 U.S.A. 
Copyright © 2017 by DEStech Publications, Inc. 
No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of the publisher. 
Manufactured in the U.S.A. 
Main entry under title: 
2017 3rd International Conference on Applied Mechanics and Mechanical Automation (3rd AMMA 2017)
ISBN: 978-1-60595-479-0
Permission for publication outside of this Conference Proceeding must be given by the Publisher.

• Email [email protected] to purchase full access to this entire journal issue for only $25.00
• International Conference on Applied Mechanics and Mechanical Automation (AMMA 2017)
• ISBN: 978-1-60595-471-4
• ISSN: 2475-885X

The 2017 International Conference on Applied Mechanics and Mechanical Automation (AMMA) eagerly look forward to the participation and presentation of worldwide scientists in Hong Kong on June 23 and 24, 2017. As a scientific forum, AMMA 2017 will offer to its participants the opportunity and chance to learn the latest knowledge in the field and find support among first-class researchers. We believe that the exchange of thoughts and discussion of ideas within participants will provide great impetus to both the work of attendees and the advance of the subject.

As a standard, DEStech will submit the technical science conference proceedings to be indexed in EI (Citation and Compendex). DEStech will submit the technical science conference proceedings to EI, Clarivate Analytics (formerly Thomson Reuters Web of Science) and CNKI Scholar for worldwide online citation within one month after the Proceedings is completed. Please note that DEStech does not submit Proceedings of Social Science to EI since they will not be accepted for EI Compendex. However, DEStech will submit proceedings of Social Science to Thomson Reuters Conference Proceedings Citation Index-Social Science & Humanities (CPCI-SSH). We also caution our editors that Proceedings containing plagiarized material and Proceedings advertised that they will definitely be accepted by EI will be rejected by EI.

2017 International Conference on Applied Mechanics and Mechanical Automation
439 North Duke Street 
Lancaster, Pennsylvania 17602 U.S.A. 
Copyright © 2017 by DEStech Publications, Inc. 
No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of the publisher. 
Manufactured in the U.S.A. 
Main entry under title: 
2017 International Conference on Applied Mechanics and Mechanical Automation (AMMA 2017)
ISBN: 978-1-60595-471-4
Permission for publication outside of this Conference Proceeding must be given by the Publisher.

• Email [email protected] to purchase full access to this entire journal issue for only $25.00
• 2nd International Conference on Applied Mechanics and Mechatronics Engineering (AMME 2017)
• ISBN: 978-1-60595-521-6
• ISSN: 2475-885X

2017 2nd International Conference on Applied Mechanics and Mechatronics Engineering (AMME 2017) is going to be held in Shanghai, China from 26–27 November, 2017. AMME 2017 is co-sponsored by Science and Engineering Research Center, Hong Kong. The conference program covers keynote, oral and poster presentations from scientists working in similar areas with a view to establish platforms for collaborative research projects and to find potential for international cooperation opportunities in the area of Applied Mechanics and Mechatronics Engineering.

As a standard, DEStech will submit the technical science conference proceedings to be indexed in EI (Citation and Compendex). DEStech will submit the technical science conference proceedings to EI, Clarivate Analytics (formerly Thomson Reuters Web of Science) and CNKI Scholar for worldwide online citation within one month after the Proceedings is completed. Please note that DEStech does not submit Proceedings of Social Science to EI since they will not be accepted for EI Compendex. However, DEStech will submit proceedings of Social Science to Thomson Reuters Conference Proceedings Citation Index-Social Science & Humanities (CPCI-SSH). We also caution our editors that Proceedings containing plagiarized material and Proceedings advertised that they will definitely be accepted by EI will be rejected by EI.

2017 2nd International Conference on Applied Mechanics and Mechatronics Engineering
439 North Duke Street 
Lancaster, Pennsylvania 17602 U.S.A. 
Copyright © 2017 by DEStech Publications, Inc. 
No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of the publisher. 
Manufactured in the U.S.A. 
Main entry under title: 
2017 2nd International Conference on Applied Mechanics and Mechatronics Engineering (AMME 2017)
ISBN: 978-1-60595-521-6
Permission for publication outside of this Conference Proceeding must be given by the Publisher.

• Email [email protected] to purchase full access to this entire journal issue for only $25.00
• 2nd International Conference on Applied Mathematics, Simulation and Modelling
• ISBN: 978-1-60595-480-6
• ISSN: 2475-885X

Encouraged by the great success of the previous editions of 2016 International Conference on Applied Mathematics, Simulation and Modelling (AMSM 2016), which was regarded as a global academic feast during the period of May 28–29, 2016 in Beijing, China, AMSM 2017 is arriving. We are pleased to share with you that the proceedings of AMSM 2016 have been successfully indexed by CPCI-S. The goal of AMSM 2017 is to provide an inter-disciplinary platform for researchers to exchange ideas, present results, share experience, stimulate new research, and foster collaborations among researchers, professionals, and application developers on the various aspects of Applied Mathematics, Simulation and Modelling.

As a standard, DEStech will submit the technical science conference proceedings to be indexed in EI (Citation and Compendex). DEStech will submit the technical science conference proceedings to EI, Clarivate Analytics (formerly Thomson Reuters Web of Science) and CNKI Scholar for worldwide online citation within one month after the Proceedings is completed. Please note that DEStech does not submit Proceedings of Social Science to EI since they will not be accepted for EI Compendex. However, DEStech will submit proceedings of Social Science to Thomson Reuters Conference Proceedings Citation Index-Social Science & Humanities (CPCI-SSH). We also caution our editors that Proceedings containing plagiarized material and Proceedings advertised that they will definitely be accepted by EI will be rejected by EI.

2017 2nd International Conference on Applied Mathematics, Simulation and Modelling
439 North Duke Street 
Lancaster, Pennsylvania 17602 U.S.A. 
Copyright © 2017 by DEStech Publications, Inc. 
No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of the publisher. 
Manufactured in the U.S.A. 
Main entry under title: 
2017 2nd International Conference on Applied Mathematics, Simulation and Modelling (AMSM 2017)
ISBN: 978-1-60595-480-6
Permission for publication outside of this Conference Proceeding must be given by the Publisher.

• Email [email protected] to purchase full access to this entire journal issue for only $25.00
• Asia-Pacific Engineering and Technology Conference (APETC 2017)
• ISBN: 978-1-60595-443-1
• ISSN: 2475-885X

The purpose of APETC 2017 is promoting the creativity of international in the scope of Engineering and Technology. Engineering is one of the most important matters of our life and with us as ever we have existed, unlike computer or information technology but unfortunately we have never known all Electronics we have used or around us. Nevertheless, we have been working very hard to discover new sources of energy we are in need of and striving non-stop for new synthetic stuffs or man-made matters. High demand has pushed our scholars, experts and professionals to continue the mission, not only for the materials themselves but non-perilous to the life and environment as well, causing the least hazard to the world. We appreciate our authors consciously to involve into that mission.

As a standard, DEStech will submit the technical science conference proceedings to be indexed in EI (Citation and Compendex). DEStech will submit the technical science conference proceedings to EI, Clarivate Analytics (formerly Thomson Reuters Web of Science) and CNKI Scholar for worldwide online citation within one month after the Proceedings is completed. Please note that DEStech does not submit Proceedings of Social Science to EI since they will not be accepted for EI Compendex. However, DEStech will submit proceedings of Social Science to Thomson Reuters Conference Proceedings Citation Index-Social Science & Humanities (CPCI-SSH). We also caution our editors that Proceedings containing plagiarized material and Proceedings advertised that they will definitely be accepted by EI will be rejected by EI.

2017 Asia-Pacific Engineering and Technology Conference
439 North Duke Street 
Lancaster, Pennsylvania 17602 U.S.A. 
Copyright © 2017 by DEStech Publications, Inc. 
No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of the publisher. 
Manufactured in the U.S.A. 
Main entry under title: 
2017 Asia-Pacific Engineering and Technology Conference (APETC 2017)
ISBN: 978-1-60595-443-1
Permission for publication outside of this Conference Proceeding must be given by the Publisher.

• Email [email protected] to purchase full access to this entire journal issue for only $25.00
• 2nd International Seminar on Applied Physics, Optoelectronics and Photonics (APOP 2017)
• ISBN: 978-1-60595-522-3
• ISSN: 2475-885X

On behalf of the Organizing Committee of The 2nd International Seminar on Applied Physics, Optoelectronics and Photonics (APOP 2017), it is my great pleasure to present this proceedings of the conference held in Shanghai, China, Dec. 30th to Dec. 31st, 2017. I would like to take this opportunity to thank all the authors and participants for their support to our conference. With the development of technology, a great variety of research results are emerging. Following the rapid development trend, APOP 2017 serves as a forum for the academic professionals and researchers to exchange the most updated information and achievements in those exciting research areas.

As a standard, DEStech will submit the technical science conference proceedings to be indexed in EI (Citation and Compendex). DEStech will submit the technical science conference proceedings to EI, Clarivate Analytics (formerly Thomson Reuters Web of Science) and CNKI Scholar for worldwide online citation within one month after the Proceedings is completed. Please note that DEStech does not submit Proceedings of Social Science to EI since they will not be accepted for EI Compendex. However, DEStech will submit proceedings of Social Science to Thomson Reuters Conference Proceedings Citation Index-Social Science & Humanities (CPCI-SSH). We also caution our editors that Proceedings containing plagiarized material and Proceedings advertised that they will definitely be accepted by EI will be rejected by EI.

2017 2nd International Seminar on Applied Physics, Optoelectronics and Photonics
439 North Duke Street 
Lancaster, Pennsylvania 17602 U.S.A. 
Copyright © 2017 by DEStech Publications, Inc. 
No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of the publisher. 
Manufactured in the U.S.A. 
Main entry under title: 
2017 2nd International Seminar on Applied Physics, Optoelectronics and Photonics (APOP 2017)
ISBN: 978-1-60595-522-3
Permission for publication outside of this Conference Proceeding must be given by the Publisher.

• Email [email protected] to purchase full access to this entire journal issue for only $25.00
• International Conferernce on Electronic, Control, Automation and Mechanical Engineering (ECAME 2017)
• ISBN: 978-1-60595-523-0
• ISSN: 2475-885X

Welcome to 2017 International Conference on Electronic, Control, Automation and Mechanical Engineering (ECAME2017). This conference will be held in Sanya, China during November 19-20, 2017. The aim of ECAME is to present the latest research and results of scientists related to Advances Electronic, Control, Automation and Mechanical Engineering topics. This conference provides opportunities for the different areas delegates to exchange new ideas and application experiences face to face, to establish business or research relations and to find global partners for future collaboration. We hope that the conference results constituted significant contribution to the knowledge in these up to date scientific fields. The focus of the conference is to establish an effective platform for institutions and industries to share ideas and to present the works of scientists, engineers, educators and students from all over the world. The organizing committee of conference is pleased to invite prospective authors to submit their original manuscripts to ECAME 2017.

As a standard, DEStech will submit the technical science conference proceedings to be indexed in EI (Citation and Compendex). DEStech will submit the technical science conference proceedings to EI, Clarivate Analytics (formerly Thomson Reuters Web of Science) and CNKI Scholar for worldwide online citation within one month after the Proceedings is completed. Please note that DEStech does not submit Proceedings of Social Science to EI since they will not be accepted for EI Compendex. However, DEStech will submit proceedings of Social Science to Thomson Reuters Conference Proceedings Citation Index-Social Science & Humanities (CPCI-SSH). We also caution our editors that Proceedings containing plagiarized material and Proceedings advertised that they will definitely be accepted by EI will be rejected by EI.

2017 International Conferernce on Electronic, Control, Automation and Mechanical Engineering

DEStech Publications, Inc.
439 North Duke Street Lancaster, Pennsylvania 17602 U.S.A.

Copyright © 2017 by DEStech Publications, Inc.

No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of the publisher.

Manufactured in the U.S.A.

Main entry under title:
2017 International Conferernce on Electronic, Control, Automation and Mechanical Engineering (ECAME 2017)

ISBN: 978-1-60595-523-0

Permission for publication outside of this Conference Proceeding must be given by the Publisher.

• Email [email protected] to purchase full access to this entire journal issue for only $25.00
• 2nd International Conference on Electrical and Electronics: Techniques and Applications (EETA 2017)
• ISBN: 978-1-60595-416-5
• ISSN: 2475-885X

EETA 2017, an International conference on Electrical and Electronics: Techniques and Applications will be held on January 15–16, in the capital city of China, Beijing. It is the second opening of EETA. With objective to build the communicative bridge between scholars and researchers in different field, EETA 2017 is well-prepared and welcome all contributors who share the same interest in Electrical and Electronics. The first EETA (EETA 2015) was held on August 23–24, 2015, in Phuket, Thailand. It witnessed the progress in modern Electrical Engineering and the high-speed development and update of electronic products. Gratifying result has been achieved that after the conference, all selected papers were published and included in Thomson Reuters Web of Science CPCI-S (ISTP indexing). We are really appreciated for people who devoted their energy and time to this conference. Two years has passed and we need to have a new look at those techniques and applications. EETA 2017 will offer the chance for engineers and scholars to meet and discuss with peer experts face to face.

As a standard, DEStech will submit the technical science conference proceedings to be indexed in EI (Citation and Compendex). DEStech will submit the technical science conference proceedings to EI, Clarivate Analytics (formerly Thomson Reuters Web of Science) and CNKI Scholar for worldwide online citation within one month after the Proceedings is completed. Please note that DEStech does not submit Proceedings of Social Science to EI since they will not be accepted for EI Compendex. However, DEStech will submit proceedings of Social Science to Thomson Reuters Conference Proceedings Citation Index-Social Science & Humanities (CPCI-SSH). We also caution our editors that Proceedings containing plagiarized material and Proceedings advertised that they will definitely be accepted by EI will be rejected by EI.

2017 2nd International Conference on Electrical and Electronics: Techniques and Applications
DEStech Publications, Inc. 
439 North Duke Street 
Lancaster, Pennsylvania 17602 U.S.A. 
Copyright © 2017 by DEStech Publications, Inc. 
No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of the publisher. 
Manufactured in the U.S.A. 
Main entry under title: 
2017 2nd International Conference on Electrical and Electronics: Techniques and Applications (EETA 2017)
ISBN: 978-1-60595-416-5
Permission for publication outside of this Conference Proceeding must be given by the Publisher.

• Email [email protected] to purchase full access to this entire journal issue for only $25.00
• 2nd International Conference on Architectural Engineering and New Materials (ICAENM 2017)
• ISBN: 978-1-60595-436-3
• ISSN: 2475-884X

The 2nd International Conference on Architectural Engineering and New Materials (ICAENM 2017) creates an academic platform for international experts and researchers in relative fields to share and exchange the latest research results and problem solving solutions. ICAENM 2017 has collected advanced results and trends in the field of Civil Engineering, Architectural Engineering, Rock Engineering and New Materials.

As a standard, DEStech will submit the technical science conference proceedings to be indexed in EI (Citation and Compendex). DEStech will submit the technical science conference proceedings to EI, Clarivate Analytics (formerly Thomson Reuters Web of Science) and CNKI Scholar for worldwide online citation within one month after the Proceedings is completed. Please note that DEStech does not submit Proceedings of Social Science to EI since they will not be accepted for EI Compendex. However, DEStech will submit proceedings of Social Science to Thomson Reuters Conference Proceedings Citation Index-Social Science & Humanities (CPCI-SSH). We also caution our editors that Proceedings containing plagiarized material and Proceedings advertised that they will definitely be accepted by EI will be rejected by EI.

2017 2nd International Conference on Architectural Engineering and New Materials
DEStech Publications, Inc. 
439 North Duke Street 
Lancaster, Pennsylvania 17602 U.S.A. 
Copyright © 2017 by DEStech Publications, Inc. 
No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of the publisher. 
Manufactured in the U.S.A. 
Main entry under title: 
2017 2nd International Conference on Architectural Engineering and New Materials (ICAENM 2017)
ISBN: 978-1-60595-436-3
Permission for publication outside of this Conference Proceeding must be given by the Publisher.