Development of Particle-containing Epoxy-resin Polishing Pads

Abstract

The process of polishing glassware is critically important in the production of flat-panel displays, lenses and cover glass. This study focused on the development of a new particle-containing epoxy-resin polishing pad. The addition of polymer particles to an epoxy-resin polishing pad improves the polishing performance by retaining and increasing the invasive ability of the abrasives. The fine surface asperity of the particle-containing polishing pad is improved as the polishing process advances since the wear rate between the embedded polymer particles and the epoxy-resin matrix differ. Polymer particles embedded within the epoxy-resin matrix fixate abrasives on the polishing pad. The new particle-containing polishing pad has a greater material removal rate as compared to the traditional polishing pad. The hydrophilicity, hardness, and size of the polymer particles employed within a particle-containing epoxy-resin polishing pad can significantly improve polishing performance and efficiency over that typically experienced with traditional polishing approaches.