- Email [email protected] to purchase full access to this entire journal issue for only $25.00
- International Conference on Energy, Power and Materials Engineering (EPME 2018)
- ISBN: 978-1-60595-102-7
- ISSN: 2475-8833
EPME2018 will provide an uncommon opportunity to present personal research findings on the fields of Energy, Power and Materials Engineering and communicate with each others for all the experts and scholars. It will be a good platform for all the experts and scholars from all over the world to publish and present personal works.
As a standard, DEStech will submit the technical science conference proceedings to be indexed in EI (Citation and Compendex). DEStech will submit the technical science conference proceedings to EI, Clarivate Analytics (formerly Thomson Reuters Web of Science) and CNKI Scholar for worldwide online citation within one month after the Proceedings is completed. Please note that DEStech does not submit Proceedings of Social Science to EI since they will not be accepted for EI Compendex. However, DEStech will submit proceedings of Social Science to Thomson Reuters Conference Proceedings Citation Index-Social Science & Humanities (CPCI-SSH). We also caution our editors that Proceedings containing plagiarized material and Proceedings advertised that they will definitely be accepted by EI will be rejected by EI.
2018 International Conference on Energy, Power and Materials Engineering
DEStech Publications, Inc.
439 North Duke Street Lancaster, Pennsylvania 17602 U.S.A.
Copyright © 2018 by DEStech Publications, Inc.
No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of the publisher.
Manufactured in the U.S.A.
Main entry under title:
2018 International Conference on Energy, Power and Materials Engineering (EPME 2018)
ISBN: 978-1-60595-102-7
Permission for publication outside of this Conference Proceeding must be given by the Publisher.